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하위분류
Brand Description
TIM Solution
Underfill/EMC Solution
R&D
하위분류
R&D Status
R&D Field
ESG
하위분류
Ethical Management
CUSTOMER
하위분류
Customer
Notice
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Affiliated company
Location
BUSINESS
Brand Description
TIM Solution
Underfill/EMC Solution
R&D
R&D Status
R&D Field
ESG
Ethical Management
CUSTOMER
Customer
Notice
58, Daepungsandan-ro, Daeso-myeon, Eumseong-gun, Chungcheongbuk-do, Republic of Korea
+82-43-530-1500
BUSINESS
Brand Description
TIM Solution
Underfill/EMC Solution
Brand Description
TIM Solution
Underfill/EMC Solution
Brand Description
TIM Solution
Underfill/EMC Solution
Brand Description
TIM Solution
Underfill/EMC Solution
BUSINESS
TIM Solution
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Brand Description
TIM Solution
Underfill/EMC Solution
BUSINESS
Brand Description
TIM Solution
Underfill/EMC Solution
TIM
SOLUTION
Urethane
2K adhesive composed of polyol resin and isocyanate
Solvent free type adhesive cured at room temperature
Applied to the device which requires the heat management by thermal conductive performance
Excellent thermal conductivity, weather resistance, durability, mechanical and electrical properties
Excellent workability with 1:1 volume ratio mixing process
SPEC
swipe
Drag left or right
CKE-
TAU-T1002
TAU-T2003
TAU-T3004
Measurement specifications
Specific gravity
1.95 ± 0.2
2.17 ± 0.2
2.82 ± 0.2
ASTM D1475
Mixing viscosity(Pa∙s)
400 – 600
400 – 600
250 - 300
ASTM D2196
Mixing ratio
(Base : Hardener)
1:1
1:1
1:1
Volume ratio
Thermal conductivity
(W/mK)
1.2
2
3
ISO 22007-2
Lap shear strength(MPa)
8 ~ 10
9 ~ 11
9 ~ 11
ASTM D1002
180° Peel test (gf/cm)
2000 ~ 3000
2000 ~ 2500
2100 ~ 2400
ASTM D 903
(Bare PET)
Volume resistivity(Ωcm)
> 1 x 10
13
> 1 x 10
13
> 1 x 10
11
ASTM D257
Flammability
V0
V0
V0
UL-94
Silicone
It is a product composed of Polyvinylsiloxane and Hydride, providing 2K TIM product and 1K grease
No by product and fast cured at room temperature
Applied to the device which requires the heat management by thermal conductive performance
Excellent thermal conductivity, weather resistance, durability, mechanical and electrical properties
Low molecular weight siloxane and less oil bleeding
SPEC
swipe
Drag left or right
Product Name
TGS-T1003
TG-T1002
TG-T3001
Type
Gap filler
Grease
Grease
Viscosity
Pa.s
400 ~ 600
100 ~ 200
200 ~ 300
Mixing ratio (Resin : Hardener)
1 : 1
-
-
Density
2 ± 0.2
2.3 ± 0.2
2.6 ± 0.2
Cure condition
Room temp (5hrs)
-
-
Thermal conductivity
W/mK
1.5
1.5
3
Hardness
Shore D
8 ~ 12
-
-
Surface resistivity (Ω/sq)
> 1x 10
14
> 1x 10
12
> 1x 10
12
Flammability
V0
-
-
Use Temp Range
℃
20 ~ 40
-40 ~ 150
-40 ~ 150
Low molecular weight siloxane content
<100 ppm
<100 ppm
<100 ppm
Epoxy
1K adhesive composed of Epoxy resin and latent curing agent
Applied to the device which requires the heat management by thermal conductive performance
Excellent thermal conductivity, weather resistance, durability, mechanical and electrical properties
SPEC
swipe
Drag left or right
Product Name
TAE-T2001
TAE-T3004
TAE-T4006
Viscosity
Pa.s
500 ~ 700
550 ~ 750
70 ~ 170
Thixotropic index
4.5 ± 0.5
4.5 ± 0.5
1.4 ± 0.5
Density
2.6 ± 0.1
2.7 ± 0.1
2.8 ± 0.1
Cure condition
150℃ / 60min
150℃ / 20min
Thermal conductivity
W/mK
2
3
4
Hardness
Shore A
60 ~ 70
60 ~ 70
60 ~ 80
Lap shear strength
Mpa
4.0 ~ 5.0
3.0 ~ 4.0
-
Volume resistivity
Ωcm
>1.0 × 10
12
>1.0 × 10
12
>1.0 × 10
13
Storage condition
Below -20℃
Shelf life
6 month