CK이엠솔루션
CK이엠솔루션

CK이엠솔루션

TIM SOLUTION
Urethane
  • 2K adhesive composed of polyol resin and isocyanate
  • Solvent free type adhesive cured at room temperature
  • Applied to the device which requires the heat management by thermal conductive performance
  • Excellent thermal conductivity, weather resistance, durability, mechanical and electrical properties
  • Excellent workability with 1:1 volume ratio mixing process
SPEC
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CKE- TAU-T1002 TAU-T2003 TAU-T3004 Measurement specifications
Specific gravity 1.95 ± 0.2 2.17 ± 0.2 2.82 ± 0.2 ASTM D1475
Mixing viscosity(Pa∙s) 400 – 600 400 – 600 250 - 300 ASTM D2196
Mixing ratio
(Base : Hardener)		 1:1 1:1 1:1 Volume ratio
Thermal conductivity
(W/mK)		 1.2 2 3 ISO 22007-2
Lap shear strength(MPa) 8 ~ 10 9 ~ 11 9 ~ 11 ASTM D1002
180° Peel test (gf/cm) 2000 ~ 3000 2000 ~ 2500 2100 ~ 2400 ASTM D 903
(Bare PET)
Volume resistivity(Ωcm) > 1 x 1013 > 1 x 1013 > 1 x 1011 ASTM D257
Flammability V0 V0 V0 UL-94
Silicone
  • It is a product composed of Polyvinylsiloxane and Hydride, providing 2K TIM product and 1K grease
  • No by product and fast cured at room temperature
  • Applied to the device which requires the heat management by thermal conductive performance
  • Excellent thermal conductivity, weather resistance, durability, mechanical and electrical properties
  • Low molecular weight siloxane and less oil bleeding
SPEC
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Product Name TGS-T1003 TG-T1002 TG-T3001
Type Gap filler Grease Grease
Viscosity Pa.s 400 ~ 600 100 ~ 200 200 ~ 300
Mixing ratio (Resin : Hardener) 1 : 1 - -
Density 2 ± 0.2 2.3 ± 0.2 2.6 ± 0.2
Cure condition Room temp (5hrs) - -
Thermal conductivity W/mK 1.5 1.5 3
Hardness Shore D 8 ~ 12 - -
Surface resistivity (Ω/sq) > 1x 1014 > 1x 1012 > 1x 1012
Flammability V0 - -
Use Temp Range ℃ 20 ~ 40 -40 ~ 150 -40 ~ 150
Low molecular weight siloxane content <100 ppm <100 ppm <100 ppm
Epoxy
  • 1K adhesive composed of Epoxy resin and latent curing agent
  • Applied to the device which requires the heat management by thermal conductive performance
  • Excellent thermal conductivity, weather resistance, durability, mechanical and electrical properties
SPEC
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Product Name TAE-T2001 TAE-T3004 TAE-T4006
Viscosity Pa.s 500 ~ 700 550 ~ 750 70 ~ 170
Thixotropic index 4.5 ± 0.5 4.5 ± 0.5 1.4 ± 0.5
Density 2.6 ± 0.1 2.7 ± 0.1 2.8 ± 0.1
Cure condition 150℃ / 60min 150℃ / 20min
Thermal conductivity W/mK 2 3 4
Hardness Shore A 60 ~ 70 60 ~ 70 60 ~ 80
Lap shear strength Mpa 4.0 ~ 5.0 3.0 ~ 4.0 -
Volume resistivity Ωcm >1.0 × 1012 >1.0 × 1012 >1.0 × 1013
Storage condition Below -20℃
Shelf life 6 month