R&D
R&D

R&D Status

  • 01. TIM Solution
  • 02. Semiconductor Solution
  • 03. EMI Solution
  • 04. Flame barrier Solution
01 TIM SOLUTION
  • 1K/2K products based on Urethane, Epoxy, silicone material
  • Thermal conductive solution R&D and commercialization (EV car, Semi-conductor, LED, etc.)
  • High insulation, thermal resistance and customized thermal conduction performance
Urethane
Adhesive Gap Filler
Silicone
Gap Filler Grease
Epoxy
Adhesive
ABOUT PATENT
certification
CK EM Solution
ELECTROMAGNETIC WAVE SHIELDING COATING COMPOSITION
10-1736898-0000
certification
CK EM Solution
ULTRAVIOLET CURABLE COATING COMPOSITION FOR PROTECTING LAYER SHIELDING ELECTROMAGNETIC INTERFERENCE
10-1958240-0000
certification
CK EM Solution
THERMAL ADHESIVE COMPOSITION HAVING LOW DIELECTRIC CONSTANT AND METHOD FOR MANUFACTURING THE SAME
10-2457897-0000
certification
CK EM Solution
THERMAL ADHESIVE COMPOSITION CAPABLE OF WEIGHT REDUCTION AND METHOD FOR MANUFACTURING THE SAME
10-2397281-0000
swipe좌, 우 드래그가능
Type Title of Invention Registration Date Applicant Registration Country Registration No.
Patents ELECTROMAGNETIC WAVE SHIELDING COATING COMPOSITION 2017.05.16 CK EM Solution Republic of Korea 10-1736898-0000
Patents ULTRAVIOLET CURABLE COATING COMPOSITION FOR PROTECTING LAYER SHIELDING ELECTROMAGNETIC INTERFERENCE 2019.03.08 CK EM Solution Republic of Korea 10-1958240-0000
Patents THERMAL ADHESIVE COMPOSITION HAVING LOW DIELECTRIC CONSTANT AND METHOD FOR MANUFACTURING THE SAME 2022.10.19 CK EM Solution Republic of Korea 10-2457897-0000
Patents THERMAL ADHESIVE COMPOSITION CAPABLE OF WEIGHT REDUCTION AND METHOD FOR MANUFACTURING THE SAME 2022.05.09 CK EM Solution Republic of Korea 10-2397281-0000
02 Semi-conductor PACKAGING SOLUTION
Underfill

Epoxy-Anhydride
Epoxy-Amine

  • Void free, Good Flowability & Reliability
  • Low Bump, Non filler Type
  • Product development of Flip-chip Underfill Applied Fine filler
EMC

Epoxy-Anhydride

  • Compression Mold용 Liquid EMC(LMC)
  • A paste product consisting of silica with a maximum size of 20 μm or less.
  • Application to FOWLP, Gap filling C-Mold
03 EMI SOLUTION
[ Principle of EMI shielding ]
  • Electronic device malfunction and signal quality improvement due to electromagnetic interference and noise
  • Product development in the form of Paste, Sheet, Coating solution
  • Applied to products of autonomous car parts and IOT, Artificial Intelligence, etc
  • Composed of composite material with excellent electrical performance of metal, conductive polymer/carbon, etc
  • Goal of securing various types and industry of products combining resin composition technology
04 Flame barrier coating SOLUTION
  • After 1300℃ flame, above 20min, keep the electric insulation property
  • Curing condition (150℃/30min or 25℃/1day)
  • Solvent type (Alcohol) coating agent
  • High impact strength (Flexibility)
Spray
Test
Effect