R&D

R&D Status

01 TIM SOLUTION
  • 1K/2K products based on Urethane, Epoxy, silicone material
  • Thermal conductive solution R&D and commercialization (EV car, Semi-conductor, LED, etc.)
  • High insulation, thermal resistance and customized thermal conduction performance
Urethane
Adhesive Gap Filler
Silicone
Gap Filler Grease
Epoxy
Adhesive
02 Semi-conductor PACKAGING SOLUTION
Underfill

Epoxy-Anhydride
Epoxy-Amine

  • Void free, Good Flowability & Reliability
  • Low Bump, Non filler Type
  • Product development of Flip-chip Underfill Applied Fine filler
LMC

Epoxy-Anhydride

  • Liquid EMC(LMC) for Compression Mold
  • A paste product consisting of silica with a maximum size of 20 μm or less.
  • Application to FOWLP, Gap filling C-Mold
03 EMI SOLUTION
[ Principle of EMI shielding ]
  • Electronic device malfunction and signal quality improvement due to electromagnetic interference and noise
  • Product development in the form of Paste, Sheet, Coating solution
  • Applied to products of autonomous car parts and IOT, Artificial Intelligence, etc
  • Composed of composite material with excellent electrical performance of metal, conductive polymer/carbon, etc
  • Goal of securing various types and industry of products combining resin composition technology