CK이엠솔루션
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Affiliated company
Location
BUSINESS
Brand Description
TIM Solution
Structural Adhesive Solution
R&D
R&D Status
ESG
Ethical Management
CUSTOMER
Customer
Notice
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COMPANY
하위분류
About company
CEO Greetings
Affiliated company
Location
BUSINESS
하위분류
Brand Description
TIM Solution
Structural Adhesive Solution
R&D
하위분류
R&D Status
ESG
하위분류
Ethical Management
CUSTOMER
하위분류
Customer
Notice
Korea
English
COMPANY
About company
CEO Greetings
Affiliated company
Location
BUSINESS
Brand Description
TIM Solution
Structural Adhesive Solution
R&D
R&D Status
ESG
Ethical Management
CUSTOMER
Customer
Notice
58, Daepungsandan-ro, Daeso-myeon, Eumseong-gun, Chungcheongbuk-do, Republic of Korea
+82-43-530-1500
CK이엠솔루션
CK이엠솔루션
CK이엠솔루션
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CK이엠솔루션
01
TIM
SOLUTION
1K/2K products based on Urethane, Epoxy, silicone material
Thermal conductive solution R&D and commercialization (EV car, Semi-conductor, LED, etc.)
High insulation, thermal resistance and customized thermal conduction performance
Urethane
Adhesive
Gap Filler
Silicone
Gap Filler
Grease
Epoxy
Adhesive
02
Semi-conductor
PACKAGING SOLUTION
Underfill
Epoxy-Anhydride
Epoxy-Amine
Void free, Good Flowability & Reliability
Low Bump, Non filler Type
Product development of Flip-chip Underfill Applied Fine filler
EMC
Epoxy-Anhydride
Liquid EMC(LMC) for Compression Mold
A paste product consisting of silica with a maximum size of 20 μm or less.
Application to FOWLP, Gap filling C-Mold
03
EMI
SOLUTION
[ Principle of EMI shielding ]
Electronic device malfunction and signal quality improvement due to electromagnetic interference and noise
Product development in the form of Paste, Sheet, Coating solution
Applied to products of autonomous car parts and IOT, Artificial Intelligence, etc
Composed of composite material with excellent electrical performance of metal, conductive polymer/carbon, etc
Goal of securing various types and industry of products combining resin composition technology