R&D

R&D Field

ABOUT R&D
  • Based on polymer synthesis technology, we have a professional research team aimed at increased customer value. In particular, we are developing and researching various materials such as thermal conductive & EMI shielding of electric vehicles and liquid mold compound & Unerfill for semiconductor.
NOVUS - Urethane TIM [ Application and characteristics. ]
  • Adhesive type : Excellent shearing stress, adhesive force, withstand voltage, insulation and cooling efficiency
  • Non Adhesive type : Excellent mechanical properties, withstand voltage, insulation, cooling efficiency and repair characteristics
  • Testing in accordance with UL-94(grade V-0)
  • EV 2nd Battery Module and packs, ESS, LED Light and all parts which Heat Sink is applied
NOVUS - Silicone TIM [ Application and characteristics. ]
  • 2K type : Fast hardening at room temperature, low hardness, excellent insulation and cooling efficiency
  • 1K type : Immediate usability after coating. Excellent reparing proprties
  • Computer and related equipment, communication device, automotive electronic parts, all parts that require heat dissipation
NOVUS - Epoxy TIM [ Application and characteristics. ]
  • Good flexibility & toughness, Excellent adhesion & reliability performance
  • Mold and dispensing process applicable
  • Field requiring high heat resistance such as LED, ESS, PCB and semiconductor
NOVUS - Epoxy Underfill [ Application and characteristics. ]
  • Excellent adhesion & reliability performance
  • Good workability & Flowability
  • Low moisture absorption & Ion contents
  • Applied to Drive IC for display such as LCD TV, mobile phone, monitor, etc.
ABOUT PATENT
certification
CK EM Solution
ELECTROMAGNETIC WAVE SHIELDING COATING COMPOSITION
10-1736898-0000
certification
CK EM Solution
ULTRAVIOLET CURABLE COATING COMPOSITION FOR PROTECTING LAYER SHIELDING ELECTROMAGNETIC INTERFERENCE
10-1958240-0000
certification
CK EM Solution
THERMAL ADHESIVE COMPOSITION HAVING LOW DIELECTRIC CONSTANT AND METHOD FOR MANUFACTURING THE SAME
10-2022-0014539
Pending
certification
CK EM Solution
THERMAL ADHESIVE COMPOSITION CAPABLE OF WEIGHT REDUCTION AND METHOD FOR MANUFACTURING THE SAME
10-2022-0011735
Pending
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Type Title of Invention Registration Date Applicant Registration Country Registration No.
Patents ELECTROMAGNETIC WAVE SHIELDING COATING COMPOSITION 2017.05.16 CK EM Solution Republic of Korea 10-1736898-0000
Patents ULTRAVIOLET CURABLE COATING COMPOSITION FOR PROTECTING LAYER SHIELDING ELECTROMAGNETIC INTERFERENCE 2019.03.08 CK EM Solution Republic of Korea 10-1958240-0000
Patents THERMAL ADHESIVE COMPOSITION HAVING LOW DIELECTRIC CONSTANT AND METHOD FOR MANUFACTURING THE SAME 2022.02.04 CK EM Solution Republic of Korea 10-2022-0014539
Patents THERMAL ADHESIVE COMPOSITION CAPABLE OF WEIGHT REDUCTION AND METHOD FOR MANUFACTURING THE SAME 2022.01.26 CK EM Solution Republic of Korea 10-2022-0011735