Based on polymer synthesis technology, we have a professional research team aimed at increased customer value.
In particular, we are developing and researching various materials such as thermal conductive & EMI shielding of electric vehicles and liquid mold compound & Unerfill for semiconductor.
NOVUS - Urethane TIM[ Application and characteristics. ]
Adhesive type : Excellent shearing stress, adhesive force, withstand voltage, insulation and cooling efficiency
Non Adhesive type : Excellent mechanical properties, withstand voltage, insulation, cooling efficiency and repair characteristics
Testing in accordance with UL-94(grade V-0)
EV 2nd Battery Module and packs, ESS, LED Light and all parts which Heat Sink is applied
NOVUS - Silicone TIM[ Application and characteristics. ]
2K type : Fast hardening at room temperature, low hardness, excellent insulation and cooling efficiency
1K type : Immediate usability after coating. Excellent reparing proprties
Computer and related equipment, communication device, automotive electronic parts, all parts that require heat dissipation
NOVUS - Epoxy TIM[ Application and characteristics. ]
Good flexibility & toughness, Excellent adhesion & reliability performance
Mold and dispensing process applicable
Field requiring high heat resistance such as LED, ESS, PCB and semiconductor
NOVUS - Epoxy Underfill[ Application and characteristics. ]
Excellent adhesion & reliability performance
Good workability & Flowability
Low moisture absorption & Ion contents
Applied to Drive IC for display such as LCD TV, mobile phone, monitor, etc.