CK이엠솔루션
CK이엠솔루션

CK이엠솔루션

Underfill
Underfill
  • 1K product composed of high purity Epoxy and Acid Anhydride
  • Non-filler form which can be applied to low bump height(8~12㎛)
  • Good flowability
  • Providing specifications and process solutions that meet customer needs
Application Applying to drive IC of LCD TV, Mobile, Display monitor
Application method Dispensing syringe, 150℃ 2hr hardening
Application Applying to drive IC of LCD TV, Mobile, Display monitor
Application method Dispensing syringe, 150℃ 2hr hardening
SPEC
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Product Name CKE-EAU Note
Color Black -
Density 1.1 ± 0.1 ASTMD 1475
Viscosity (cps) 400 ± 100 ASTMD 2196
Gel Time 120 ± 40sec At 130℃
Tg 130 ± 20℃ ASTMD 3418
CTE α1 80 ± 10 ppm/℃ ASTME 831
α2 200 ± 50 ppm/℃
Flexural modulus (GPa) 3.0 ± 0.5 ASTMD 790
Flexural strength (MPa) 80 ± 20 ASTMD 790
Volume resistivity (Ωcm) > 1 x 1014 ASTMD 257
Cure condition Pre-cure 130 ~ 150℃ / 8~12min -
Post-cure 150℃ / 1hr -
Work life 25% After 24hrs @ 25℃
Shelf life 6 month ≤ -20℃
EMC SOLUTION
EMC (Epoxy Molding Compaound)
  • High flowability as suitable for large area and compression mold
  • Low temperature molding (at 120°C)
  • Low stress design enables low warpages in wide molds
  • Providing specifications and process solutions that meet customer needs
SPEC
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Product Name CKE-BAE
Type Compress Mold
Color Black
Filler content % 85
Filler size (aver/cut) um 6 / 20
Viscosity Pa.s 450 ~ 550
Gel Time (at 120℃) sec 160 ± 00
CTE (ppm/℃) α1 10 ± 2
α2 40 ± 5
Tg ℃ 155
Modulus GPa 16
Mold Shrinkage Mold % -0.07
PMC -0.04
Bake -0.04
Volume resistivity Ωcm >1.0 × 1013
Storage condition Below -20℃
Shelf life 6 month